Precision Laser Wire Soldering Machine for PCB Assembly

This fully automated wire-to-PCB laser soldering system is engineered for precision, consistency, and efficiency in modern electronic assembly. It integrates multiple processes into one streamlined platform, including wire cutting, stripping, tinning, and soldering one wire end directly onto PCB pads or electronic components. By consolidating these steps, the system reduces manual handling, ensures reliable quality, and significantly boosts production capacity.

Equipped with a high-precision laser soldering head, the system can complete six wire joints in a single cycle by rapidly applying solder balls through non-contact laser welding. This method ensures stable tin penetration, uniform solder distribution, and minimal thermal impact on components. The machine features four independent wire-feeding modules, each capable of supplying up to six wires, with program-controlled switching that allows seamless automated multi-color wire harness assembly—ideal for production lines that require frequent changes in wire type or color.

The platform supports multi-board panel soldering with a flexible layout that adapts to different board arrays, enabling efficient mass production without frequent repositioning. Its dual-carrier configuration allows one carrier to process while the other is being loaded or unloaded, maximizing uptime and enabling a single operator to oversee multiple machines.

Compared with manual soldering, laser soldering offers contactless precision, lower material consumption, and stable repeatability, while reducing dependency on skilled labor. The result is superior joint quality and long-term production reliability for manufacturers aiming to increase throughput.

Typical applications include soldering lithium battery protection circuits, LED light boards, instrument and breaker boards, Bluetooth headset PCBs, and electronic atomizer boards. With its advanced laser soldering technology and strong cost-performance value, this solution is well-suited for high-precision, high-efficiency electronic manufacturing.