Dual-Station Low Pressure Top Injection Molding Machine

This dual-station low-pressure top injection molding machine is specifically designed for the precise and reliable overmolding of sensitive electronic components such as PCBs, sensors, coil assemblies, wire terminals, and automotive connectors. By integrating a top-injection system with a fully enclosed melt tank and independent heating zones, it ensures consistent glue flow, minimal thermal stress, and superior bonding quality—ideal for high-reliability applications in electronics manufacturing.

The machine features two fully independent workstations, enabling alternating operations: while one side performs injection molding, the other side can be loaded or unloaded simultaneously. This design dramatically increases productivity and reduces idle time, making it perfect for both high-volume production and small-batch prototyping.

Equipped with a touchscreen PLC control system, the machine provides real-time monitoring, process visualization, and intuitive operation. Safety is enhanced with emergency stop functions, light curtains, and independent station control. The compact vertical design optimizes workspace usage while delivering stable, repeatable performance across production cycles.