Low Pressure Top Injection Molding Machine

This top-injection low-pressure molding machine is purpose-built for precision overmolding of sensitive electronic components, including wire harnesses, connectors, sensors, and PCB assemblies. Its compact vertical design combines clamping and injection in a single top-down motion, enabling gravity-assisted insert positioning for improved accuracy and material flow.

Engineered for delicate parts, the system utilizes controlled low injection pressure to minimize mechanical stress on internal circuitry and components. An integrated melt tank with Teflon-coated surfaces and independently regulated heating zones ensures stable operation, consistent glue flow, and hassle-free maintenance.

Designed with operator efficiency and safety in mind, this vertical low-pressure injection molding solution features ergonomic foot control, a user-friendly touchscreen interface, and a clean, accessible mold area. Safety mechanisms such as interlocked guards and optional light curtains further enhance production security.

Ideal for low-to-medium volume production or high-mix manufacturing environments, this compact overmolding machine offers exceptional precision, repeatability, and process stability—making it a reliable and cost-effective choice for manufacturers of modern electronic assemblies.