English
This low-pressure double-slide injection molding system is designed for high-precision encapsulation and gentle molding of sensitive electronic components, connectors, and adhesive-based parts. Its dual sliding plate mechanism enables smooth, repeatable part insertion and ejection, minimizing stress on delicate components during production.
Ideal for applications in electronics, medical devices, and automotive wiring, the machine ensures consistent quality by combining horizontal glue injection with vertical mold closing. The flexible configuration supports custom workflows, including insert molding and multi-material bonding, making it a versatile solution for modern manufacturing environments.
With an optional servo-driven energy-saving motor and customizable clamping force, this system reduces operational costs while enhancing cycle stability, making it suitable for high-volume, low-defect production lines across diverse industries.
| Clamping Force | 1 ton (customizable) |
| Injection Amount | 1–80 g |
| Glue Injection Method | Side injection via double sliding plate design |
| Voltage | AC 220 V (customizable) |
| Overall Dimensions | 1550 × 1210 × 1930 mm |
Product Updates: Images and videos displayed may differ from current products due to ongoing design improvements and updates. The actual delivered product shall prevail in case of any discrepancy.
Optional Accessories: Some accessories and components shown in product photos/videos are optional configurations and not included in the standard package. Please order these items separately if required.
Technical Parameters: Specifications are for reference only. Equipment suitability depends on actual working conditions, not just parameter comparison. Please consult us to confirm compatibility for your specific application.
