Dual-Station Low Pressure Side Injection Molding Machine

Engineered for high-precision encapsulation of sensitive electronic components, this dual-station side-injection low-pressure molding machine ensures uninterrupted production through alternating operation—while one station molds, the other is being loaded. This design significantly reduces downtime and increases overall throughput, making it ideal for high-volume manufacturing environments across electronics, medical, and automotive industries.

Featuring a fully integrated melt tank with independent heating zones and PID temperature control, the machine delivers consistent glue metering and uniform bonding with minimal thermal stress. The system eliminates the need for external heating heads and glue hoses, simplifying setup and enhancing long-term reliability.

With a robust touchscreen PLC interface, real-time monitoring, and comprehensive safety features—including emergency stop, light curtains, and dual-hand actuation—the machine supports safe, efficient operation even in demanding production settings. It is specially designed for overmolding delicate parts like PCBs, wire terminals, sensors, and automotive connectors, ensuring superior protection against moisture, dust, vibration, and thermal shock.