English
This rotary table low-pressure injection molding machine is engineered for the precision encapsulation of sensitive electronic components such as sensors, PCBs, and coils, delivering reliable protection without causing thermal or mechanical damage.
Featuring a dual-station rotary disk and PLC control system, it enables continuous automated production, significantly improving efficiency while ensuring operator safety through integrated light curtains and emergency stop functions.
The machine’s compact design, rubber hose injection system, and support for multi-nozzle configurations make it ideal for high-mix, low-volume manufacturing in the electronics, automotive, and consumer device industries.
| Item | KS-J1130R | KS-J1130LR |
| Hose diameter / Length | Φ8×1500 mm | 25 mm |
| Injection Pressure | 1.5–4 kg/cm² | 0–40 kg/cm² |
| Theoretical ejection capacity | 2–50 g/oz | 150 g/oz |
| Nozzle stroke | 50 mm | 150 mm |
| Rubber cylinder capacity | 6 L | 3 L |
| Clamping Force | 1–5 tons (optional) | 10 tons |
| Opening Force | 0.4 tons | 7 tons |
| Platen Size | 600 mm | |
| Mold column spacing | 300×150 mm | |
| Clamping Stroke | 150 mm | 180 mm |
| Maximum mold opening spacing | 250–330 mm (optional) | 330 mm |
| Minimum mold thickness | 100–180 mm (customizable) | 200 mm (customizable) |
| Ejection force | 0.2 tons | 1 ton |
| Ejection stroke | 50 mm | |
| Main intake pressure | 5.0–7.0 kg/cm² | |
| Power requirement | 380 | |
| Motor Power | 0.2 kW | 9 kW |
| Total Wattage | 3.0 kW | |
| Working power | 6.8 kW | |
| Machine Weight | 0.80 tons | 800 kg |
| Machine Dimensions (L×W×H) | 1060×1180×1700 mm | 1700×900×1900 mm |
