Low-Pressure Side Injection Molding Machine

This low-pressure side-injection molding machine is engineered for precision encapsulation of sensitive electronic components, delivering consistent, high-reliability seals without thermal or mechanical stress—ideal for PCBs, sensors, connectors, coils, and battery assemblies.

Equipped with a hose-free side injection design and a top-mounted single injection unit, the machine enables unobstructed access for encapsulating irregularly shaped components with clean, efficient processing and faster cycle times. Its robust construction ensures high repeatability and reliability in high-volume production settings.

The intuitive LCD digital interface, multi-language PLC control, and real-time process monitoring allow for seamless operation, while adjustable injection pressure and precise mold temperature regulation (via DELTA modules) deliver stable results across diverse materials and production conditions. The built-in top ejection mechanism ensures smooth product removal without manual handling, minimizing downtime.

Designed with operator safety and workflow efficiency in mind, it includes a light curtain and emergency stop switch, complemented by an ergonomic foot pedal layout that reduces fatigue. This dependable, scalable solution combines speed, accuracy, and sustainability for advanced electronics protection.