Automatic Terminal Cross Section Analysis System

This fully automatic terminal cross-section analysis system is designed to provide fast, precise, and reliable evaluation of wire harness terminations. It integrates automated cutting, grinding, polishing, etching, imaging, and intelligent analysis into one streamlined process, enabling users to complete the entire cross-section preparation and inspection workflow with just one click.

Equipped with advanced optical imaging and intelligent vision algorithms, the system automatically identifies and measures key characteristics such as crimp height, wire compression ratio, burr formation, and voids. This ensures consistent, repeatable results while eliminating manual judgment errors. The automated workflow significantly improves efficiency, allowing operators to obtain detailed analytical reports in minutes.

The system features modular design architecture, combining multiple functional units such as precision cutting, high-speed polishing, intelligent etching, and automatic imaging. Each module operates under coordinated digital control, providing stable, clean, and high-quality sample preparation. The built-in cooling and dust-removal systems enhance safety and prolong equipment lifespan, ensuring reliable performance in continuous production environments.

Its intelligent analysis software offers automatic image recognition and report generation, supporting statistical analysis and traceability for quality control. The results can be exported or integrated into factory information systems, making it a powerful tool for modern manufacturing environments where accuracy and repeatability are critical.

This cross-sectional analysis equipment is widely used in industries such as automotive, electronics, electrical appliances, communication, aerospace, and new energy. It is particularly suitable for evaluating wire harnesses, crimp terminals, solder joints, and various metallic connectors, ensuring compliance with international quality standards and supporting high-level R&D, inspection, and production monitoring tasks.

With its all-in-one automation, intelligent analysis, and high imaging precision, this system provides an ideal solution for enterprises pursuing efficiency, reliability, and quality assurance in terminal processing and microstructure inspection.