This fully automatic wire-to-PCB soldering machine integrates multiple processes into one compact system, including wire cutting, stripping, tinning, terminal crimping, housing insertion, and PCB soldering. It can handle multiple wires simultaneously, with one end crimped terminals and inserted into housings, while the other end is soldered onto PCB pads.
Equipped with four soldering heads, the system supports simultaneous soldering of four wires, and through shifting functionality it can complete multiple soldering points in a single cycle. Connectors are automatically fed by a vibration bowl. A built-in CCD vision system ensures terminals are properly inserted into housings, and an optional crimping force monitor provides real-time pressure curve monitoring, automatically stopping the machine in case of abnormalities.
The system is optimized for multi-board panel soldering. Its intelligent layout adapts to different board arrays, enabling efficient batch soldering without repositioning. Each machine is equipped with dual carriers—while one carrier is in process, the other can be loaded or unloaded—maximizing uptime and allowing a single operator to oversee multiple machines simultaneously.
Compared with manual soldering, this solution achieves full tin penetration, highly consistent solder volumes, and reduced material consumption, while significantly lowering dependence on skilled operators. It offers manufacturers a reliable path to increasing capacity with stable, repeatable quality.
Typical applications include lithium battery protection boards, LED lighting panels, voltmeter and disjunctor circuit boards, Bluetooth headset boards, and electronic atomizer modules. With its flexibility, efficiency, and cost-effectiveness, the machine is an ideal choice for electronics mass production, ensuring long-term profitability from a single investment.
Applicable Wire Gauge | AWG18–AWG28 |
Cutting Length | 20–200 mm (customizable) |
Stripping Length | Soldering end: 0–5 mm (adjustable) Crimping end: 0–10 mm (adjustable) |
Wire Feeding Capacity | 2–12 wires |
Number of Soldering Heads | 4 |
Head Spacing | Min. 26 mm (closed), Max. 65 mm (open)![]() |
Pad Requirements | Pad width: 1–1.5 mm; spacing > 0.5 mm |
Max. Soldering Area | ≤ 250 × 250 mm |
Production Capacity | 1300–2200 connectors/cycle |
Required Air Pressure | 0.5–0.7 MPa (650 L/min) |
Rated Power | 6.5 kW |
Power Supply | AC 220 V, 50/60 Hz (customizable) |
Machine Dimensions | 2640 × 1740 × 1950 mm |
Optional Features | Windows 11 control system (MES integration), terminal crimping force monitor, automatic wire prefeeder, automatic loading/unloading system. Customized solutions available upon request |
Product Updates: Images and videos displayed may differ from current products due to ongoing design improvements and updates. The actual delivered product shall prevail in case of any discrepancy.
Optional Accessories: Some accessories and components shown in product photos/videos are optional configurations and not included in the standard package. Please order these items separately if required.
Technical Parameters: Specifications are for reference only. Equipment suitability depends on actual working conditions, not just parameter comparison. Please consult us to confirm compatibility for your specific application.