Laser Solder Ball Soldering Robot with CCD Vision

This laser solder ball soldering machine represents a cutting-edge solution for advanced electronic packaging applications. It features an XYZR four-axis precision motion platform combined with a proprietary high-accuracy solder ball feeder and advanced vision algorithms, delivering stable, accurate, and efficient solder ball welding for diverse components.

Unlike traditional soldering methods, the solder ball process eliminates residual solder issues and ensures consistent, high-quality joints. The laser heating system provides rapid energy transfer with excellent thermal efficiency, enabling reliable processing of even deep solder joints. The machine supports solder balls as small as 0.15 mm, making it ideal for miniaturized and high-density electronic assemblies.

Equipped with a PC-based control interface, the system offers intuitive programming, CAD drawing import capabilities, and real-time monitoring via high-definition display. Operators can freely adjust speed, solder ball size, and process parameters, ensuring flexibility for different production requirements. Built-in CCD vision positioning guarantees precise alignment and accurate soldering results.

The equipment integrates advanced functions including adjustable soldering speed, solder volume control, and closed-loop laser temperature regulation. With premium sensors and high-performance optical modules, the system delivers exceptional process stability. Scrap-free soldering and flux-free operation minimize contamination and maximize component lifespan.

This machine demonstrates significant advantages in production efficiency, capable of completing heating and soldering within 0.2 seconds. It ensures consistent quality, high yield rates, and compatibility with inline mass production environments. Dual-station or tray-based feeding options further enhance throughput and adaptability to automated production lines.

The laser solder ball machine finds wide application across multiple industries, including semiconductor packaging, smartphone and camera modules, FPC connectors, MEMS devices, BGA packages, automotive electronics, aerospace components, and optical communication products. With its combination of precision, speed, and reliability, it represents a state-of-the-art solution for modern electronics manufacturing.